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Sulfide Induced Intergranular Corrosion of Copper in Salt Water Containing Benzotriazole

机译:硫化物诱导的苯并三唑盐水中铜的晶间腐蚀

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This paper investigates the effect of pretreatment with benzotriazole on the corrosion of copper in sulfide polluted salt water. The treatment of copper in the presence of benzotriazole under a mild oxidizing potential reveals the remarkable inhibition efficiency of BTAH reflected in a passive current of less than 0.1 μA cm-2 after one hour. Upon injection of 10-3 M HS-, a rapid increase in current to about 200 μA was obtained. The current jump seen after injection of sulfide ions is due to localized intergranular corrosion as shown by the scanning electron microscopy (SEM) examination. Copper suffered only localized corrosion occurred at the grain boundaries while the grain surfaces remained well protected. Under this condition, sulfur was detected using energy dispersive spectroscopy (EDS) at the grain boundaries, but not on the grain surfaces. X-ray photoelectron spectroscopy revealed the presence of sulfide ions and BTAH on the corroded surface. [DOI: 10.1380/ejssnt.2011.306]
机译:本文研究了苯并三唑预处理对硫化物污染盐水中铜腐蚀的影响。一小时后,在小于0.1μAcm-2的无源电流中,在苯并三唑存在下的中等氧化电位下对铜进行的处理显示出BTAH的显着抑制效率。注入10-3 M HS-时,电流迅速增加至约200μA。注入硫化物离子后看到的电流跳跃是由于局部晶间腐蚀所致,如扫描电子显微镜(SEM)检查所示。铜仅在晶粒边界发生局部腐蚀,而晶粒表面仍受到良好保护。在这种条件下,使用能量色散光谱法(EDS)在晶界而不是在晶粒表面检测到硫。 X射线光电子能谱显示腐蚀表面上存在硫化物离子和BTAH。 [DOI:10.1380 / ejssnt.2011.306]

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