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Low Resistance and Highly Reflective Sb-Doped SnO_2/Ag Ohmic Contacts to p-Type GaN for Flip-Chip LEDs

机译:用于倒装芯片LED的p型GaN的低电阻和高反射率Sb掺杂SnO_2 / Ag欧姆接触

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We have investigated high-quality Sb-doped SnO_2/Ag ohmic contacts to p-GaN for use in flip-chip light emitting diodes (LEDs). The Sb-doped SnO_2 /Ag contacts produce specific contact resistances of approx 10~(-4) OMEGA cm_2 upon annealing at 430 and 530 deg C for 1 min in air. It is shown that InGaN blue LEDs fabricated with the Sb-doped SnO_2 /Ag contacts give a forward-bias voltage of 3.18 V at 20 mA, while LEDs with Ag contacts show 3.36 V. It is further shown that the LEDs made with the Sb-doped SnO_2 /Ag contact layers show higher light output power compared with the LEDs with the Ag contacts
机译:我们已经研究了用于p-GaN的高质量Sb掺杂SnO_2 / Ag欧姆接触,可用于倒装芯片发光二极管(LED)。在空气中在430和530摄氏度下退火1分钟后,掺Sb的SnO_2 / Ag触点会产生约10〜(-4)OMEGA cm_2的比接触电阻。结果表明,掺有Sb的SnO_2 / Ag触点制成的InGaN蓝色LED在20 mA时提供3.18 V的正向偏压,而带有Ag触点的LED则显示3.36V。进一步表明,由Sb制成的LED与具有Ag触点的LED相比,掺杂SnO_2 / Ag触点层显示出更高的光输出功率

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