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首页> 外文期刊>Electrochemical and solid-state letters >Improved Schottky Leakage Current of In_(0.5)Al_(0.5)As/In_(0.5)Ga_(0.5)As Metamorphic HEMTs Using (NH_4)_2S_x Treatment
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Improved Schottky Leakage Current of In_(0.5)Al_(0.5)As/In_(0.5)Ga_(0.5)As Metamorphic HEMTs Using (NH_4)_2S_x Treatment

机译:(NH_4)_2S_x处理改善了In_(0.5)Al_(0.5)As / In_(0.5)Ga_(0.5)As变质HEMT的肖特基漏电流

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摘要

Surface passivation process play an important role, especially in high-power In_(0.5)A1_(0.5)As/In_(0.5)Ga_(0.5)As metamorphic high-electron-mobility transistor (MHEMT) applications, and a passivation pretreatment technology has been proposed in this study. Before the deposition of SiN_x passivation layers, submicrometer MHEMTs were subjected in (NH_4)_2S_x solution with UV-light illumination instead of hot (NH_4)_2S_x solution. The Schottky gate turn-on voltage was improved from 0.41 to 0.52 V after (NH_4)_2S_x + UV-light treatment due to the reduction of surface leakage current. Besides, the surface state density was also enhanced by this process, resulting in a higher current density and a higher input power swing range. The passivated 0.2 mu m long gate MHEMTs with (NH_4)_2S_x pretreatment exhibited a minimum noise figure (NF_(min)) of 0.46 dB and an associated gain of 18 dB at 5 GHz operation.
机译:表面钝化过程起着重要作用,尤其是在大功率In_(0.5)A1_(0.5)As / In_(0.5)Ga_(0.5)As变质高电子迁移率晶体管(MHEMT)应用中,钝化预处理技术具有重要意义。在这项研究中提出。在沉积SiN_x钝化层之前,先在(NH_4)_2S_x溶液中用紫外线照射亚微米MHEMT,而不是在热(NH_4)_2S_x溶液中进行。 (NH_4)_2S_x + UV光处理后,由于降低了表面漏电流,肖特基栅极的导通电压从0.41 V提高到0.52V。此外,通过该过程还提高了表面状态密度,从而导致更高的电流密度和更高的输入功率摆幅范围。经过(NH_4)_2S_x预处理的钝化的0.2微米长的栅极MHEMT在5 GHz工作频率下的最小噪声指数(NF_(min))为0.46 dB,相关增益为18 dB。

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