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Parallel Algorithm for the Quasi-TEM Analysis of Microstrip Multiconductor Line

机译:微带多导体线准TEM分析的并行算法

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摘要

The generalized structure of the microstrip multiconductor line (MMCL) is shown in Fig. 1 (a). The MMCL consists of a dielectric substrate with a conducting layer (ground plane) on the one side and microstrip conductors on the other side. The number of microstrip conductors, their width and space between them may be specified independently. Due to their planar design these lines are broadly used in many electronics areas, e.g. as transmission lines for data paths in computer systems and integrated circuits [1], directional couplers [2], etc. MMCL are also successfully used as physical models designing microwave devices such as retard systems [3-5] (Fig. 1 (b)), antennas [6], etc.
机译:微带多导体线(MMCL)的一般结构如图1(a)所示。 MMCL由介电基板组成,该介电基板的一侧具有导电层(接地层),另一侧具有微带导体。微带导体的数量,其宽度和间距可以独立指定。由于其平面设计,这些线被广泛用于许多电子领域,例如作为计算机系统和集成电路[1],定向耦合器[2]等中数据路径的传输线。MMCL还成功地用作设计微波设备(如延迟系统[3-5])的物理模型(图1(b )),天线[6]等。

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