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Level set reconstruction of conductivity and permittivity from boundary electrical measurements using experimental data

机译:使用实验数据从边界电学测量中电导率和介电常数的水平集重构

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摘要

A shape reconstruction method for electrical resistance and capacitance tomography is presented using a level set formulation. In this shape reconstruction approach, the conductivity (or permittivity) values of the inhomogeneous background and the obstacles are assumed to be (approximately) known, but the number, sizes, shapes, and locations of these obstacles have to be recovered from the data. A key point in this shape identification technique is to represent geometrical boundaries of the obstacles by using a level set function. This representation of the shapes has the advantage that the level set function automatically handles the splitting or merging of the objects during the reconstruction. Another key point of the algorithm is to solve the inverse problem of finding the interfaces between two materials using a narrowband method, which not only decreases the number of unknowns and therefore the computational cost of the inversion, but also tends to improve the condition number of the discrete inverse problem compared to pixel (voxel)-based image reconstruction. Level set shape reconstruction results shown in this article are some of the first ones using experimental electrical tomography data. The experimental results also show some improvements in image quality compared with the pixel-based image reconstruction. The proposed technique is applied to 2D resistance and capacitance tomography for both simulated and experimental data. In addition, a full 3D inversion is performed on simulated 3D resistance tomography data.
机译:使用水平集公式提出了一种用于电阻和电容层析成像的形状重建方法。在这种形状重建方法中,假设(大约)已知非均匀背景和障碍物的电导率(或介电常数)值,但是必须从数据中恢复这些障碍物的数量,大小,形状和位置。这种形状识别技术的关键是通过使用水平集功能来表示障碍物的几何边界。形状的这种表示具有以下优点:级别设置功能在重建过程中自动处理对象的分裂或合并。该算法的另一个关键点是解决使用窄带方法找到两种材料之间的界面的逆问题,这不仅减少了未知数,因此减少了反演的计算成本,而且还倾向于提高条件数。与基于像素(体素)的图像重建相比,离散逆问题更为明显。本文显示的水平集形状重建结果是使用实验性X线断层扫描数据的第一批结果。实验结果还表明,与基于像素的图像重建相比,图像质量有所改善。拟议的技术适用于二维电阻和电容层析成像的模拟和实验数据。另外,对模拟的3D电阻层析成像数据执行完整的3D反演。

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