...
首页> 外文期刊>ISA Transactions >Thermal response simulation for tuning PID controllers in a 1016 mm guarded hot plate apparatus
【24h】

Thermal response simulation for tuning PID controllers in a 1016 mm guarded hot plate apparatus

机译:热响应仿真,用于调节1016 mm保护热板设备中的PID控制器

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

A mathematical model has been developed and used to simulate the controlled thermal performance of a large guarded hot-plate apparatus. This highly specialized apparatus comprises three interdependent components whose temperatures are closely controlled in order to measure the thermal conductivity of insulation materials. The simulation model was used to investigate control strategies and derive controller gain parameters that are directly transferable to the actual instrument. The simulations take orders-of-magnitude less time to carry out when compared to traditional tuning methods based on operating the actual apparatus. The control system consists primarily of a PC-based PID control algorithm that regulates the output voltage of programmable power amplifiers. Feedback parameters in the form of controller gains are required for the three heating circuits. An objective is to determine an improved set of gains that meet temperature control criteria for testing insulation materials of interest. The analytical model is based on aggregated thermal capacity representations of the primary components and includes the same control algorithm as used in the actual hot-plate apparatus. The model, accounting for both thermal characteristics and temperature control, was validated by comparisons with test data. The tuning methodology used with the simulation model is described and results are presented. The resulting control algorithm and gain parameters have been used in the actual apparatus without modification during several years of testing materials over wide ranges of thermal conductivity, thickness, and insulation resistance values.
机译:已经开发了数学模型并用于模拟大型防护热板设备的受控热性能。这种高度专业的设备包括三个相互依存的组件,其温度受到严格控制,以便测量绝缘材料的导热率。仿真模型用于研究控制策略并导出可直接转移到实际仪器的控制器增益参数。与基于实际设备操作的传统调谐方法相比,该仿真所花费的时间要少几个数量级。该控制系统主要由基于PC的PID控制算法组成,该算法可调节可编程功率放大器的输出电压。三个加热回路都需要采用控制器增益形式的反馈参数。一个目标是确定一组满足温度控制标准的改进增益,以测试目标绝缘材料。该分析模型基于主要部件的总热容量表示,并且包括与实际热板设备中使用的控制算法相同的控制算法。该模型同时考虑了热特性和温度控制,并与测试数据进行了比较验证。描述了与仿真模型一起使用的调整方法,并给出了结果。在数年的热导率,厚度和绝缘电阻值测试范围内,经过数年的测试,所得到的控制算法和增益参数已在实际设备中使用,未经修改。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号