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THERMOELECTRIC PROPERTIES OF BORON AND BORON PHOSPHIDE CVD WAFERS

机译:硼和磷化硼CVD晶片的热电性质

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Electrical and thermal conductivities and thermoelectric power of p-type baron and n-type boron phosphide wafers with amorphous and polycrystalline structures were measured up to high temperatures, The electrical conductivity of amorphous boron wafers is compatible to that of polycrystals at high temperatures and obeys Mott's T-1/4 rule, The thermoelectric power of polycrystalline boron decreases with increasing temperature, while that of amorphous boron is almost constant in a wide temperature range, The weak temperature dependence of the thermal conductivity of BP polycrystalline wafers reflects phonon scattering by grain boundaries, Thermal conductivity of an amorphous baron wafer is almost constant in a wide temperature range, showing a characteristic of a glass, The figure of merit of polycrystalline BP wafers is 10(-7)/K at high temperatures while that of amorphous boron is 10(-5)/K. (C) 1997 Academic Press. [References: 20]
机译:在高温下测量具有非晶和多晶结构的p型钡和n型磷化硼晶片的电导率和热导率以及热电功率。在高温下,非晶硼晶片的电导率与多晶的电导率兼容,并且服从Mott的T-1 / 4规则,多晶硼的热电功率随温度升高而降低,而非晶硼的热电功率在宽温度范围内几乎恒定,BP多晶晶片的导热性对温度的弱依赖性反映了晶界对声子的散射,非晶态钡晶片的导热系数在很宽的温度范围内几乎是恒定的,表现出玻璃的特性。在高温下,多晶BP晶片的品质因数为10(-7)/ K,而非晶硼晶片的品质因数为10 (-5)/ K。 (C)1997学术出版社。 [参考:20]

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