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首页> 外文期刊>International Journal of Refractory Metals & Hard Materials >Influence of pretreatment and deposition parameters on the properties and cutting performance of NCD coated PCB micro drills
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Influence of pretreatment and deposition parameters on the properties and cutting performance of NCD coated PCB micro drills

机译:预处理和沉积参数对NCD涂层PCB微钻的性能和切削性能的影响

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摘要

Nowadays, a broad growing market of printed circuit board (PCB) micro drills has been developed. In this study, nano- crystalline diamond (NCD) coated printed circuit broad (PCB) micro drills are fabricated by the hot filament chemical vapor deposition (HFCVD) technique. The main factors affecting their cutting performance are generally their breaking strength, film-substrate adhesion, continuity and smoothness of coatings, and coating thickness. Consequently, the corresponding pretreatment and deposition parameters including pretreatment zone, pretreatment time in Murakami's reagent, substrate temperature during the deposition process, as well as the deposition time are optimized. A novel pretreatment zone, only involving cutting zone of micro drill, is proposed by cantilever flexural tests. Then, the substrate temperature is optimized to be about 850 °C by temperature simulation and its verification tests. Furthermore, the pretreatment time in Murakami's reagent and the deposition time are determined to be 10 min and 2 h by high speed dry drilling of copper clad laminates (CCLs).
机译:如今,已经开发了广泛增长的印刷电路板(PCB)微钻市场。在这项研究中,通过热丝化学气相沉积(HFCVD)技术制造了纳米晶金刚石(NCD)涂层印刷电路板(PCB)微型钻头。影响其切割性能的主要因素通常是其断裂强度,薄膜与基材的附着力,涂层的连续性和光滑度以及涂层厚度。因此,优化了相应的预处理和沉积参数,包括预处理区,村上试剂中的预处理时间,沉积过程中的基板温度以及沉积时间。通过悬臂弯曲试验提出了一种仅涉及微钻切削区域的新型预处理区域。然后,通过温度模拟及其验证测试,将基板温度优化为约850°C。此外,通过对覆铜板(CCL)进行高速干法钻孔,将村上试剂中的预处理时间和沉积时间确定为10分钟和2小时。

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