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首页> 外文期刊>International Journal of Precision Technology >A novel plasma-assisted atomistic surface finishing on freeform surfaces of fused silica
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A novel plasma-assisted atomistic surface finishing on freeform surfaces of fused silica

机译:在熔融石英自由曲面上的新型等离子体辅助原子表面处理

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摘要

A novel non-contact type plasma-assisted atomistic surface finishing of freeform surface on a fused silica is conceived. The developed process is targeted to obtain ultrafine surface finish while eliminating the surface and subsurface damages. Stable plasma with He and Ne processing gases and O_2 and SF_6 reactive gases up to 30 mbar pressure is achieved by using dielectric barrier capacitive coupled RF discharge. Atomic emission spectroscopy is used to identify the relative density of the excited species in the plasma to study the atomistic material removal mechanism. On machined fused silica surface, improvement in surface roughness is up to 68% with He-O_2 plasma while there is 85% improvement in surface waviness. Further surface finish improvement is achieved with He-SF_6-O_2 gas mixture plasma with 0.008 mm~3/min material removal rate. Atomistic material removal has also enabled reduction in surface residual stresses and surface cracks thereby enhancing the surface integrity.
机译:设想了一种新颖的非接触型等离子体辅助的熔融石英表面自由曲面的原子表面精加工。开发的工艺旨在获得超细的表面光洁度,同时消除表面和亚表面的损坏。通过使用介电势垒电容耦合RF放电,可以在高达30 mbar的压力下获得稳定的等离子体,其中含有He和Ne处理气体以及O_2和SF_6反应气体。原子发射光谱法用于确定等离子体中激发物种的相对密度,以研究原子材料的去除机理。在机加工的熔融石英表面上,使用He-O_2等离子体可使表面粗糙度提高68%,而表面波纹度则可提高85%。 He-SF_6-O_2混合气体等离子体的材料去除速率为0.008 mm〜3 / min,可进一步改善表面光洁度。原子材料的去除还能够减少表面残余应力和表面裂纹,从而提高表面完整性。

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