首页> 外文期刊>International journal of nanoscience >SILICON NANOWIRE TRANSISTOR FABRICATED BY AFM NANOLITHOGRAPHY FOLLOWED BY WET CHEMICAL ETCHING PROCESS
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SILICON NANOWIRE TRANSISTOR FABRICATED BY AFM NANOLITHOGRAPHY FOLLOWED BY WET CHEMICAL ETCHING PROCESS

机译:通过AFM纳米照相术制造的硅纳米电子晶体管,接着进行湿法化学蚀刻工艺

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摘要

Atomic force microscope (AFM) nanolithography was performed to create nanowire transistor pattern via local anodic oxidation process on surface of silicon-on-insulator (SOI) wafer. This nanoscale oxide pattern is used as a mask system for chemical etching to produce silicon nanowire transistor. The device with component structures of a silicon nanowire (SiNW) as channel with source, drain, and gate pads had been drawn at 9 V tip voltage, 6 μm/s writing speed with humidity 55.8-68.9% RH. The designed device was etched with tetramethylammonium hydroxide (TMAH) to remove uncovered silicon layer but oxide pattern remains. In order to obtain SiNW transistor, sample was etched using hydrogen fluoride (HF) to remove oxide layer. From the AFM and field emission scanning electron microscope (FESEM) observation found that the SiNW transistor with wire size of 92.65 nm in wire thickness, 90.83 nm wire width and 10.30 μm in length with contact pads size of about 5 μm×5 μm has been successfully fabricated.
机译:进行原子力显微镜(AFM)纳米光刻,以通过绝缘体上硅(SOI)晶片表面上的局部阳极氧化工艺创建纳米线晶体管图案。该纳米级氧化物图案用作化学蚀刻以生产硅纳米线晶体管的掩模系统。以9 V尖端电压,6μm/ s的写入速度和湿度55.8-68.9%RH绘制了以硅纳米线(SiNW)的组件结构作为具有源极,漏极和栅极焊盘的沟道的器件。用氢氧化四甲基铵(TMAH)蚀刻设计的器件,以去除未覆盖的硅层,但保留氧化物图案。为了获得SiNW晶体管,使用氟化氢(HF)蚀刻样品以去除氧化物层。通过AFM和场发射扫描电子显微镜(FESEM)的观察发现,SiNW晶体管的线宽为92.65 nm,线宽为90.83 nm,长为10.30μm,接触垫的尺寸约为5μm×5μm。成功制造。

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