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首页> 外文期刊>International Journal of Machine Tools & Manufacture: Design, research and application >An evaluation of surface asperity profile changes in truncation processes using optical interferometric microscope
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An evaluation of surface asperity profile changes in truncation processes using optical interferometric microscope

机译:使用光学干涉显微镜评估截断过程中表面粗糙轮廓的变化

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The truncation process as running-in wear was applied to evaluate surface asperity changes as removal at the top of its asperity profile. The measurement was done using an optical interferometric microscope. Whole surface profile was measured by the microscope supported by the stitching technique. The specimen was relocated on the microscope utilizing Hirth coupling as a hardware technique. Data obtained from a truncated specimen were precisely relocated to the original untruncated specimen by computer software in three dimensions. Then the profile change was obtained by deducting truncated data from the original data. The profile change was calculated as removed volume. The volume changes are plotted against a sliding length. As the software relocation technique needs the unchanged profile of a valley part, the evaluation is limited to where the truncation height is higher than - 1.28 sigma (the standard deviation of untruncated original profile height). The present research can detect very little volume change that cannot be measured by other conventional methods, such as the gravimetric method. The advantages of the present method are as follows. It is possible to compare the truncated surface profile with the original untruncated surface profile in three dimensions. Thus, the inclination of the truncation surface can be evaluated and any other local changes can also be assessed. From this information the profiles of truncated surfaces will be linked to functions, and new parameters for truncation profile will be presented.
机译:应用截断过程作为磨合磨损,以评估表面粗糙度变化,该粗糙度变化是在其粗糙度轮廓的顶部去除的。使用光学干涉显微镜进行测量。通过缝合技术支持的显微镜测量整个表面轮廓。使用Hirth耦合作为硬件技术将标本重新放置在显微镜上。通过计算机软件在三个维度上将从截短的标本中获取的数据精确地重新定位到原始的截短的标本中。然后,通过从原始数据中减去截断的数据来获得轮廓更改。轮廓变化计算为去除体积。相对于滑动长度绘制体积变化。由于软件重定位技术需要凹形部分的轮廓不变,因此评估仅限于截断高度高于-1.28 sigma(未截断的原始轮廓高度的标准偏差)的地方。本研究可以检测到很少的体积变化,而其他常规方法(如重量法)无法测量到这种变化。本方法的优点如下。可以在三个维度上将截断的表面轮廓与原始的未截断的表面轮廓进行比较。因此,可以评估截断表面的倾斜度,也可以评估其他局部变化。从这些信息中,截断面的轮廓将链接到函数,并且将显示截断轮廓的新参数。

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