Board-level multi-cavity shielding: Photo-chemical machining offers significant advantages over traditional methods of manufacture

摘要

THE EVER-INCREASING DEMANDS ON RF and microwave circuitry design and development teams to achieve EMC, eliminate crosstalk, save PCB real estate, decrease overall product size, provide access for rework and, last but not least, reduce production costs, has led to the development of labyrinth and lid shielding assemblies.