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CHARACTERISTIC OF (100)-TEXTURED (Pb_xSr_(1-x))TiO_3 THIN FILMS USED FOR DRAM AND TUNABLE DEVICE APPLICATION

机译:(100)-纹理(Pb_xSr_(1-x))TiO_3薄膜的特点用于DRAM和可调谐器件

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摘要

The Pb_xSr_(1-x))TiO_3 (PST) thin films were deposited on LaNiO_3 (LNO(100))/ Pt/Ti/SiO_3/Si substrates electrode by RF-magnetron sputtering using three different Pb target composition ranging from 32.5 percent approx 37.5 percent and different process condition. Structural and dielectric properties of the PST thin films for tunable microwave and DRAM application were investigated. The PST thin films deposited at 400 deg C show higher dielectric constant than those post-annealed at 600 deg C because of better crystallization. The former also have lower leakage current around 10~(-8) A/cm~2 up to applied field of 350 kv/cm, which is suitable for DRAM application. On the other hand, the post-annealed PST thin films have satisfactory tunability around 58 percent and figure of merit around 30, which are more suitable for microwave device application.
机译:通过RF磁控溅射使用三种不同的Pb靶组成(约占32.5%),将Pb_xSr_(1-x))TiO_3(PST)薄膜沉积在LaNiO_3(LNO(100))/ Pt / Ti / SiO_3 / Si衬底电极上37.5%的工艺条件不同。研究了可调谐微波和DRAM应用的PST薄膜的结构和介电性能。在400摄氏度下沉积的PST薄膜比在600摄氏度后退火的薄膜具有更高的介电常数,因为其结晶性更好。前者在350 kv / cm的施加电场下,泄漏电流也较低,约为10〜(-8)A / cm〜2,非常适合DRAM应用。另一方面,后退火的PST薄膜具有令人满意的约58%的可调性和约30的品质因数,这更适合于微波设备的应用。

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