CRYSTAL ION SLICING OF DOMAIN MICROENGINEERED ELECTRO-OPTIC DEVICES ON LITHIUM NIOBATE

摘要

We report the successful fabrication of 6 #mu#m thick slices from a ferroelectric domain micro-engineered LiNbO_3 wafer device using the crystal ion slicing technique. The device was created by micropatterning ferroelectric domains in a bulk 0.3 mm thick wafer of z-cut LiNbO_3, followed by ion-implanting with high energy He+ ions to create a damage layer at a well defined depth from the surface. Etching away this damaged layer in dilute hydrofluoric acid results in a liftoff of the top slice in which the ferroelectric domain patterns are left intact.