Effects of Ga addition on the wetting properties and tensile properties of Sn-Zn-Ag solder alloys

摘要

The effects of Ga addition on the wetting properties and tensile properties of Sn-8.55Zn-0.5Ag-xGa lead-free solder alloys are investigated. The x content of the solders investigated is 0 similar to 3 wt%. The results indicate that Ga exhibits a prominent influence on the wetting behavior as well as the mechanical properties of the solders. The wetting properties are improved remarkably with the increase of the Ga content in the Sn-8.55Zn-0.5Ag lead-free solder. The tensile test shows that 1 similar to 2 % Ga alloys have significant improvement in UTS, when compared with that of the binary Sn-Zn and Sn-Zn-OS Ag alloys. As for Sn-Zn-0.5Ag, the addition of Ga elements has provided a good wetting force, wetting time and tensile strength.