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Carbon nanotube thin film transistors fabricated by an etching based manufacturing compatible process

机译:碳纳米管薄膜晶体管制造是基于蚀刻制造兼容过程

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摘要

Carbon nanotube thin film transistors (CNT-TFTs) have been regarded as strong competitors to currently commercialized TFT technologies. Though much progress has been achieved recently, CNT-TFT research is still in the stage of laboratory research. One critical challenge for commercializing CNT-TFT technology is that the commonly used device fabrication method is a lift-off based process, which is not suitable for mass production. In this paper, we report an etching based fabrication process for CNT-TFTs, which is fully manufacturing compatible. In our process, the CNT thin film channel was patterned by dry etching, while wet etching was used for patterning the layers of metal and insulator. The CNT-TFTs were successfully fabricated on a 4 inch wafer in both top-gate and buried-gate geometries with low Schottky barrier contact and pretty uniform performance. High output current (>1.2 mu A mu m(-1)), high on/off current ratio (>10(5)) and high mobility (>30 cm(2) V-1 s(-1)) were obtained. Though the fabrication process still needs to be optimized, we believe our research on the etching fabrication process pushes CNT-TFT technology a step forward towards real applications in the near future.
机译:碳纳米管薄膜晶体管(CNT-TFTs)被视为强劲的竞争对手目前商业化的TFT技术。最近取得的进展,大部分CNT-TFT研究仍处于实验室阶段研究。商业化是CNT-TFT技术制造方法是一种常用的设备基于发射的过程,这是不适合大规模生产。蚀刻CNT-TFTs制造过程为基础,这是和生产完全相容。过程中,CNT薄膜是有图案的频道干蚀刻,而用于湿蚀刻模式层的金属和绝缘体。4英寸CNT-TFTs成功伪造晶片上平巷和buried-gate几何图形较低的肖特基势垒接触和漂亮统一的性能。μm(1)),高开/关流动比率(> 10 (5))和高迁移率(> 30厘米(2)与它们(1))获得的。需要优化,我们相信我们的研究蚀刻加工过程推动CNT-TFT对真正的技术进步应用程序在不久的将来。

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