Rapid transient-liquid-phase bonding of Al_2O_3 with microdesigned Ni/Nb/Ni interlayers

摘要

The vast majority of man-made devices contain joints between similar or dissimilar materials. Ideally, joining is fast, reliable, and inexpensive. In this work we demonstrate that robust refractory joints between Al_2O_3 bodies can be produced rapidly and consistently by a transient-liquid-phase bonding process exploiting microengineered multilayer Ni/Nb/Ni interlayers. Samples were bonded for times ranging from 5 min to 6 h at 1400℃. Well-bonded assemblies were produced in all cases. Interlayers with remelt temperatures > 2200℃ were achieved in as little as 5 min at 1400℃. In room-temperature bend tests, fractures initiated and propagated almost exclusively in the ceramic. Extension of this approach to other advanced ceramics should be possible, providing a rapid and reliable alternative to conventional joining approaches.