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机译:微孔铜的润湿性的变化层由不同的模式电沉积
National Institute of Technology,Department of Mechanical Engineering,Calicut 673601,India;
National Institute of Technology,Department of Chemical Engineering,Calicut 673601,India;
DEPOSITION TIME; Wettability; CopperARCHITECTURESurface engineeringNanostructureBuilding construction;
机译:Ultrasonically-prepared copper-doped铯卤纳米晶体与光明和稳定的发射
机译:LOW-TEMPERATURE EMISSIVITY OF THIN AL2O3 LAYERS DEPOSITED ON COPPER SUBSTRATE
机译:Interlayer Expansion of the Layered Zeolite precursor RUB-39: a Universal method To synthesize Functionalized microporous silicates
机译:Eletroformacao:principios Eletroquimicos processo de Eletrodeposicao E Eletroformacao de Cobre(Electroformation:Electrodeposition and Electroformation of Copper的原理电化学过程)