首页> 外文期刊>Journal of Photopolymer Science and Technology >Production of Three-dimensional Nickel Microstructures by Electroless Plating on Through-hole-type Polymer Micromold
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Production of Three-dimensional Nickel Microstructures by Electroless Plating on Through-hole-type Polymer Micromold

机译:通过孔型聚合物微胶质电镀生产三维镍微观结构

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摘要

In this study, a method to produce three-dimensional nickel microstructures by pouring an electroless plating solution into a through-hole mold made of photocurable resin is presented. Single-spiral and double-spiral models of 100-mu m-diameter wires and 450-mu m-long bunny models with 40-mu m-thick ears at the minimum were fabricated using nickel, which was obtained from the resin mold. After the inflow plating into the through-hole resin mold, the spiral shape was found to be successfully transformed to the nickel product after the resin mold was sublimated. For the bunny model, dip plating was added after the inflow plating to the thin ears for successful transfer of original mold shape. The fine structure of the model surface suggested that the replication accuracy achieved the resolution of the optical lamination modeling.
机译:在这项研究中,提出了一种通过将化学镀溶液注入由光固化树脂制成的通孔模具中来制备三维镍微结构的方法。使用从树脂模具中获得的镍,制作了直径为100μm的单根螺旋和双螺旋线模型,以及至少有40μm厚耳朵的450μm长兔子模型。在通孔树脂模具中进行流入电镀后,发现树脂模具升华后,螺旋形状成功转化为镍产品。对于兔子模型,在薄耳朵的流入电镀后添加浸镀,以成功转移原始模具形状。模型表面的精细结构表明,复制精度达到了光学叠片建模的分辨率。

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