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首页> 外文期刊>Technical physics letters: Letters to the Russian journal of applied physics >Plasmachemical and Wet Etching in the Postgrowth Technology of Solar Cells Based on the GaInP/GaInAs/Ge Heterostructure
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Plasmachemical and Wet Etching in the Postgrowth Technology of Solar Cells Based on the GaInP/GaInAs/Ge Heterostructure

机译:基于GAINP / GAINAS / GE异质结构的太阳能电池生成技术中的PLASMACHEMICAL和湿法蚀刻

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Studies have been carried out and a technology has been developed for the formation of a separating mesa structure in fabrication of multi-junction solar cells based on the GaInP/GaInAs/Ge heterostructure. Methods for etching of the heterostructure layers have been studied: wet chemical etching in compositions based on HBr, K2Cr2O7, and H2O and the plasmachemical etching in a flow of the BCl3 working gas. A comparative analysis of the etching methods was made. Protective masks based on a photoresist layer and TiOx/SiO2 were developed. Multi-junction solar cells with low leakage current (less than 10(-7) A at a voltage of 0.5-1 V) were fabricated.
机译:在基于GaInP/GaInAs/Ge异质结构的多结太阳能电池的制造中,已经进行了研究并开发了一种用于形成分离台面结构的技术。研究了异质结构层的蚀刻方法:在基于HBr、K2Cr2O7和H2O的成分中进行湿化学蚀刻,以及在BCl3工作气体流中进行等离子体蚀刻。对腐蚀方法进行了比较分析。研制了基于光刻胶层和TiOx/SiO2的防护掩模。制作了低漏电流(0.5-1v电压下小于10(-7)A)的多结太阳能电池。

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