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Decomposition of the Thermal Boundary Resistance across Carbon Nanotube-Graphene Junctions to Different Mechanisms

机译:碳纳米管 - 石墨烯交配对不同机制的热抗震性分解

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摘要

Three different mechanisms are identified to contribute to thermal resistances across a carbon nanotube graphene junction: material mismatch, nonplanar junction, and defects. To isolate the contributions of each mechanism, we have designed five types of junctions and performed nonequilibrium molecular dynamics simulations. The results show that the contributions from the three mechanisms are similar, each at around 2.5 x 10(-11) m(2) K/W. The relations between thermal boundary resistance and both defect number and turning angle at the interface are also studied.
机译:鉴定了三种不同的机制以促进碳纳米管石墨烯交界处的热阻:材料失配,非平面连接和缺陷。 为了隔离每种机制的贡献,我们设计了五种类型的连接,并进行了非QuibiRiblim分子动力学模拟。 结果表明,来自三种机制的贡献相似,每个机制约为2.5×10(-11)m(2)k / w。 还研究了界面热界电阻与缺陷数量和转向角的关系。

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