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首页> 外文期刊>ACS applied materials & interfaces >Low Contact Barrier in 2H/1T' MoTe2 In-Plane Heterostructure Synthesized by Chemical Vapor Deposition
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Low Contact Barrier in 2H/1T' MoTe2 In-Plane Heterostructure Synthesized by Chemical Vapor Deposition

机译:通过化学气相沉积合成的2H / 1T'mote2内外过度结构的低接触屏障

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Metal semiconductor contact has been a critical topic in the semiconductor industry because it influences device performance remarkably. Conventional metals have served as the major contact material in electronic and optoelectronic devices, but such a selection becomes increasingly inadequate for emerging novel materials such as two-dimensional (2D) materials. Deposited metals on semiconducting 2D channels usually form large resistance contacts due to the high Schottky barrier. A few approaches have been reported to reduce the contact resistance but they are not suitable for large-scale application or they cannot create a clean and sharp interface. In this study, a chemical vapor deposition (CVD) technique is introduced to produce large-area semiconducting 2D material (2H MoTe2) planarly contacted by its metallic phase (1T' MoTe2). We demonstrate the phase-controllable synthesis and systematic characterization of large-area MoTe2 films, including pure 2H phase or 1T' phase, and 2H/1T' in-plane heterostructure. Theoretical simulation shows a lower Schottky barrier in 2H/1T' junction than in Ti/ 2H contact, which is confirmed by electrical measurement. This one-step CVD method to synthesize large-area, seamless-bonding 2D lateral metal semiconductor junction can improve the performance of 2D electronic and optoelectronic devices, paving the way for large-scale 2D integrated circuits.
机译:金属半导体联系是半导体行业的关键主题,因为它会显着影响器件性能。传统的金属已经用作电子和光电器件中的主要接触材料,但是这种选择变得越来越不充分,用于新出现的新材料,例如二维(2D)材料。半导体2D通道上的沉积金属通常由于高肖特基屏障而形成大的电阻触点。据报道,几种方法是降低接触电阻,但它们不适合大规模应用,或者它们无法创建干净和锐利的界面。在该研究中,引入了化学气相沉积(CVD)技术以产生通过其金属相(1T'Mote2)平面接触的大面积半导体2D材料(2HMote2)。我们证明了大面积Mote2膜的相控制合成和系统特征,包括纯2H相或1T'相和2H / 1T'内异质结构。理论模拟显示在2H / 1T'接线中的较低肖特基屏障,而不是在Ti / 2h接触中,通过电测量确认。这一步骤CVD方法合成大面积,无缝键合2D横向金属半导体结可以提高2D电子和光电器件的性能,为大型2D集成电路铺平道路。

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