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Nitrogen/Carbon-Coated Zero-Valent Copper as Highly Efficient Co-catalysts for TiO2 Applied in Photocatalytic and Photoelectrocatalytic Hydrogen Production

机译:氮/碳涂覆的零价铜作为施用在光催化和光电催化氢生产中的TiO2的高效助催化剂

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Zero-valent copper (Cu-0) is a promising co-catalyst in semiconductor-based photocatalysis as it is inexpensive and exhibits electronic properties similar to those of Ag and Au. However, its practical application in photocatalytic hydrogen production is limited by its susceptibility to oxidation, forming less active Cu species. Herein, we have carried out in situ encapsulation of Cu-0 nanoparticles with N-graphitic carbon layers (14.4% N) to stabilize Cu-0 nanoparticles (N/C-coated Cu) and improve the electronic communication with a TiO2 photocatalyst. A facile solvothermal procedure is used to coat the Cu-0 nanoparticles at 200 degrees C, while graphitization is achieved by calcination at 550 degrees C under an inert atmosphere. The resultant N/C-coated Cu/TiO2 composites outperform the uncoated Cu counterparts, exhibiting a 27-fold enhancement of the hydrogen evolution rate compared to TiO2 and achieving a rate of 19.03 mmol g(-1) h(-1) under UV-vis irradiation. Likewise, the N/C-coated Cu co-catalyst exhibits a less negative onset potential of -0.05 V toward hydrogen evolution compared to uncoated Cu (ca. -0.30 V). This superior activity is attributed to coating Cu-0 with N/C, which enhances the stability, electronic communication with TiO2, conductivity, and interfacial charge transfer processes. The reported synthetic approach is simple and scalable, yielding an efficient and affordable Cu-0 co-catalyst for TiO2.
机译:零价铜(Cu-0)是在基于半导体的光催化中的有前途的助催化剂,因为它便宜并且表现出类似于Ag和Au的电子性质。然而,其在光催化氢气生产中的实际应用受其对氧化的敏感性的限制,形成较少的活性Cu物种。在此,我们已经原位封装Cu-0纳米颗粒的用N-石墨碳层(14.4%N)封装,以稳定Cu-0纳米颗粒(N / C涂覆的Cu)并改善与TiO 2光催化剂的电子通信。用于在200℃下涂覆Cu-0纳米颗粒的容易溶剂,而在惰性气氛下在550℃下通过煅烧实现石墨化。得到的N / C涂覆的Cu / TiO2复合材料优于未涂覆的Cu对应物,与TiO 2相比,氢进化速率的增强并在UV下实现了19.03mmol G(-1)H(-1)的速率 - 辐照。同样地,与未涂覆的Cu(约0.30V)相比,N / C涂覆的Cu助催化剂表现出-0.05V的负发病潜力较小。这种卓越的活性归因于用N / C涂覆Cu-0,这提高了与TiO2,电导率和界面电荷转移过程的稳定性,电子通信。报告的合成方法简单且可伸缩,得到了用于TiO 2的有效且实惠的Cu-0助催化剂。

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