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Strain-rate dependence of surface/subsurface deformation mechanisms during nanoscratching tests of GGG single crystal

机译:GGG单晶纳秒测试期间表面/地下变形机制的应变速率依赖性

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摘要

Constant- and varied-depth nanoscratching tests of GGG single crystal were carried out at different scratching velocities. The morphologies of the scratched grooves and chips were analysed using scanning electron microscope. The experimental results indicated that higher scratching velocity led to shallower penetration depth, shallower residual depth, and larger continuous chips. Increasing the scratching velocity could effectively improve the plasticity and reduce the brittle-to-ductile transition depth of GGG single crystal. Based on the contact stress and contact area between the analysed sample and Berkovich indenter, a model for predicting the penetration depth was developed, which took into account the strain rate effect and elastic recovery of materials. The model was verified using constant- and varied-depth nanoscratching tests, and the predicted and experimental results were in good agreement. Subsurface damage underneath the ductile surface was characterised using transmission electron microscope. The TEM results demonstrated that higher scratching velocity led to the slipping planes appearing in more directions, which prevented the generation of long slipping plane and reduced the depth of the damage layers. The plastic deformation of GGG at the scratching velocity of 100 mu m/s was dominated by poly-crystalline nanocrystallites and amorphous phases, and was similar to that at the low scratching velocity. This study provided a fundamental understanding of the strain-rate dependence of surface/subsurface deformation mechanisms of GGG during ultra-precision machining.
机译:在不同的刮擦速度下进行GGG单晶的恒定和变化深度纳秒试验。使用扫描电子显微镜分析刮伤的凹槽和碎片的形态。实验结果表明,较高的刮擦速度导致较浅的渗透深度,较浅的剩余深度,较大的连续芯片。增加刮擦速度可以有效地改善可塑性并降低GGG单晶的脆性转变深度。基于分析的样品和Berkovich Indenter之间的接触应力和接触面积,开发了一种预测渗透深度的模型,考虑了应变率效应和材料的弹性回收。使用常数和变化深度纳秒测试验证该模型,预测和实验结果非常一致。使用透射电子显微镜表征延展表面下方的地下损伤。 TEM结果表明,较高的刮擦速度导致滑动平面出现在更方向上,这防止了长滑动平面并降低了损坏层的深度。在100μm/ s的刮擦速度下GGG的塑性变形由聚结晶纳米晶体和非晶态相来支配,并且与低刮擦速度相似。本研究提供了对超精密加工期间GGG的表面/地下变形机制的应变率依赖性的基本理解。

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