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Fabrication of porous (Ba,Sr)(Co,Fe)O3-delta (BSCF) ceramics using gelatinization and retrogradation phenomena of starch as pore-forming agent

机译:使用凝胶化和淀粉的凝胶化作为孔成型剂的多孔(BA,SR)(CO,Fe)O 3-Delta(BSCF)陶瓷的制备

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摘要

Porous (Ba,Sr)(Co,Fe)O3-delta (BSCF) ceramics with high open porosity and good electrical conductivity was fabricated using Ba0.5Sr0.5Co0.8Fe0.2O3-delta (BSCF), which shows a high mixed ionic-electronic conductivity. In general, during the fabrication of porous ceramics by the sacrificial template method using pore former particles, closed pores are easily formed unless sufficient pore former particles are added. In this study, we have devised a method using the gelatinization-retrogradation phenomena of starch for producing a porous body with an excellent percolated pore network structure. By dispersing BSCF and starch in an aqueous slurry (0-50% by weight) and heating, gelatinization of the starch occurred and the starch particles adhered to each other. Furthermore, in order to retain the percolated structure, the water solvent was removed by freeze-drying without heating to obtain a dried green body. The sintering behavior of the porous BSCF bodies prepared under various conditions was characterized by microstructural observations and relative density measurements. By optimizing the process conditions of the gelatinization and retrogradation, a porous body having an open porosity of 48.3%, and with 99% of the total pores open, was obtained. The matrix was also well connected and showed a sufficiently high conductivity which was similar to the porous bodies made by the traditional sacrificial template method.
机译:使用Ba0.5SR0.5CO0.8FE0.2O3-DELTA(BSCF)制造具有高开孔和良好导电性的多孔(BA,SR)(CO,FE)O3-DERTA(BSCF)陶瓷,其显示出高混合离子 - 电子电导率。通常,在通过使用孔前颗粒的牺牲模板法制造多孔陶瓷期间,除非加入足够的孔前颗粒,否则容易形成闭合的孔。在这项研究中,我们设计了一种使用淀粉的凝胶化 - 逆转现象的方法,用于产生具有优异的渗透孔网络结构的多孔体。通过将BSCF和淀粉分散在含水浆料中(0-50重量%)和加热,发生淀粉的凝胶化,并且凝胶颗粒彼此粘附。此外,为了保留渗透结构,通过冷冻干燥除去水溶剂,而不加热,得到干燥的生坯。在各种条件下制备的多孔BSCF体的烧结行为的特征在于微观结构观察和相对密度测量。通过优化凝胶化和逆行的过程条件,获得了开放孔隙率为48.3%的多孔体,并含有99%的总孔隙。该基质也很好地连接并且显示出足够高的导电性,其类似于传统牺牲模板方法制备的多孔体。

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