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Evaluation of contaminant particle composition by Auger Electron Spectroscopy and identification of surface organic contamination by Time of Flight Secondary Ion mass Spectrometry

机译:通过螺旋钻电子光谱评价蛋罐电子光谱法通过飞行二次离子质谱时间鉴定表面有机污染

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摘要

In this paper, we introduce our two measuring instruments for surface analysis, which can evaluate clean environment and surface contamination of silicon wafers. The SMART series based on Auger measurement technique has an ability to analyze composition of fine particles on the test wafer. In this paper, we show typical results of the SMART to detects submicron-size particles and analyze the composition. The TRIFT II based on Time of Flight Secondary Ion Mass Spectrometry can detect both of organic and metal contamination at very low level on the wafer surface. We also show several applications of this instrument.
机译:在本文中,我们介绍了两种用于表面分析的测量仪器,可以评估硅晶片的清洁环境和表面污染。 基于螺旋钻测量技术的智能系列能够分析测试晶片上的细颗粒的组成。 在本文中,我们显示了智能典型的典型结果,以检测亚微米尺寸粒子并分析组合物。 基于飞行时间二次离子质谱法的Trift II可以在晶片表面上的非常低水平地检测有机和金属污染。 我们还显示了几种应用本文的应用。

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