Chemical contamination control in semiconductor manufacturing environment

摘要

There are four types of substances targeted as chemical contaminants in semiconductor manufacturing environments: condensable hydrocarbons, acids, bases, and dopants. These are controlled by decreasing contaminant sources, selecting and applying low-volatile materials for the components of clean rooms and equipment, and using chemical air filters. Control by decreasing contaminant sources and selecting low-volatile materials must be applied throughout the environment that encloses wafers, including clean rooms, structures, and equipment. Chemical air filters, on the other hand, are usually applied locally in the periphery of targeted equipment. To achieve sufficient and economical chemical contamination control, it is essential that comprehensive measures by taken in cooperation with device, equipment, and pod manufacturers and clean room facility suppliers.