Micro-Contamination Controlled In Airborne Organics On Electrochemical Plating Process In Semiconductors

摘要

The effect of organic compounds on the electronchemical plating process is investigated. The ATD-GC/MS (Automatic Thermal Desorption - Gas Chromatography Mass Spectrometry) was applied to the analysis tool and showed that it is an effective analysis method for environmental control of TOC(Total organic compound). Via ATD-GC/MS monitoring and environmental control, we find the TOC source from another area in the Fab and succeed in isolating the TOC source through construction of partitions. The results also showed a direct correlation between the TOC concentration and the yield loss (R-squared = 0.87).