Chemical mechanical polisher technology for 300mm/0.18-0.13μm semiconductor devices

摘要

Chemical Mechanical Polisher (CMP) is now a fully accepted method of planarizing inter-dielectric layers of 200 mm/0.25 μm semiconductor devices. Ebara has made a technological breakthrough in this field by developing a CMP system for planarizing 300 mm/0.18-0.13μm devices. This system, featuring the dry-in/dry-out concept developed for 200 mm/0.25 μm semiconductor devices, is currently being demonstrated to prospective clients. Development is underway for optimizing CMP process conditions suchas those involving STI, plugs, and metal wires, as well as for slurry supply and waste fluid treatment.