Thermal design of power modules

摘要

Power devices are required to be compact in size, highly reliable, and easy to use. In reducing the packaging size of power modules, how to efficiently spread power generated in semiconductor devices and how to suppress joule heat evolved from electric wiring are important design factors. This paper describes the packages of the high current IGBT module "EconoPACK-Plus" and design examples using the thermal simulation of electric wiring. The thermal characteristics of actual EconoPACK-Plus agreed with the simulation and proved that this simulation technology was useful.