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Schottky Barrier Mediated Single-Polarity Resistive Switching in Pt Layer-Included TiO_x Memory Device

机译:含Pt层的TiO_x存储器件中的肖特基势垒介导的单极性电阻转换

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摘要

A distinct unipolar but single-polarity resistive switching behavior is observed in a TiO_x/Pt/TiO_x trilayer structure, formed by thermal oxidation of a Ti/Pt/Ti stack As a comparison, a memory device with a single TiO_x active layer (without addition of Pt midlayer) is also fabricated but it cannot perform resistive switching. Energy band diagrams are illustrated to realize the modulation of Schottky barrier junctions and current conduction in TiCvbased devices under various biasing polarities. Introduction of the Pt midlayer creates two additional Schottky barriers, which mediate the band bending potential at each metal-oxide interface and attains a rectifying current conduction at the high-resistance state. The rectifying conduction behavior is also observed with an AFM-tip as the top electrode, which implies the rectifying property is still valid when miniaturizing the device to nanometer scale. The current rectification consequently leads to a single-polarity, unipolar resistive switching and electrically rewritable performance for the TiO_x/Pt/TiO_x device.
机译:在通过Ti / Pt / Ti叠层的热氧化形成的TiO_x / Pt / TiO_x三层结构中观察到了独特的单极性但单极性电阻切换行为。也制造了Pt中间层(Pt中间层),但是它不能执行电阻切换。示出了能带图,以实现在各种偏置极性下基于TiCv的器件中肖特基势垒结的调制和电流传导。 Pt中间层的引入产生了两个附加的肖特基势垒,它们在每个金属氧化物界面介导了带弯曲势,并在高电阻状态下实现了整流电流传导。还可以使用AFM尖端作为顶部电极观察到整流传导行为,这表明当将器件小型化至纳米级时,整流性能仍然有效。电流整流因此导致TiO_x / Pt / TiO_x器件具有单极性,单极性电阻切换和电可重写性能。

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