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首页> 外文期刊>ACS applied materials & interfaces >Electron Backscatter Diffraction Study of Hexagonal Boron Nitride Growth on Cu Single-Crystal Substrates
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Electron Backscatter Diffraction Study of Hexagonal Boron Nitride Growth on Cu Single-Crystal Substrates

机译:Cu单晶衬底上六方氮化硼生长的电子背散射衍射研究

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摘要

Hexagonal boron nitride (h-BN) is an important material for the development of new 2D heterostructures. To enable this development, the relationship between crystal growth and the substrate orientation must be explored and understood. In this study, we simultaneously grew h-BN on different orientations of Cu substrates to establish the impact of substrate structure on the growth habit of thin h-BN layers. The substrates studied were a polycrystalline Cu foil, Cu(100), Cu(110), and Cu(111). Fourier transform grazing-incidence infrared reflection absorption spectroscopy (FT-IRRAS) was used to identify h-BN on copper substrates. X-ray photoelectron spectroscopy (XPS) was used to determine the effective thickness of the h-BN. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) were used to measure the morphology of the films and postgrowth crystal structure of the Cu substrates, respectively. Combining the SEM and EBSD images allowed for the correlation between h-BN film coverage and the crystal structure of Cu. It was found that the growth rate was inversely proportional to the surface free energy of the Cu surface, with Cu(111) having the most h-BN surface coverage. The Cu foil predominately crystallized with a (100) surface orientation, and likewise had a film coverage very close to the Cu(100).
机译:六方氮化硼(h-BN)是开发新型2D异质结构的重要材料。为了实现这一发展,必须探索和理解晶体生长与衬底取向之间的关系。在这项研究中,我们同时在铜衬底的不同方向上生长h-BN,以建立衬底结构对薄h-BN层生长习惯的影响。研究的基材是多晶铜箔,Cu(100),Cu(110)和Cu(111)。傅立叶变换掠入射红外反射吸收光谱法(FT-IRRAS)用于鉴定铜基底上的h-BN。 X射线光电子能谱(XPS)用于确定h-BN的有效厚度。扫描电子显微镜(SEM)和电子背散射衍射(EBSD)分别用于测量薄膜的形貌和Cu衬底的后生长晶体结构。结合SEM和EBSD图像可以使h-BN薄膜覆盖率与Cu的晶体结构相关。发现生长速率与Cu表面的表面自由能成反比,其中Cu(111)具有最大的h-BN表面覆盖率。 Cu箔主要以(100)表面取向结晶,并且同样具有非常接近Cu(100)的膜覆盖率。

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