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Fabrication of Vertically Aligned Diamond Whiskers from Highly Boron-Doped Diamond by Oxygen Plasma Etching

机译:氧等离子体刻蚀从高掺硼金刚石中制备垂直取向金刚石晶须

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摘要

Conductive diamond whiskers were fabricated by maskless oxygen plasma etching on highly boron-doped diamond substrates. The effects of the etching conditions and the boron concentration in diamond on the whisker morphology and overall substrate coverage were investigated. High boron-doping levels (greater than 8.4 X 10 cm ) are crucial for the formation of the nanosized, densely packed whiskers with diameter of ca. 20 nm, length of ca. 200 nm, and density of ca. 3.8 x 10~(10) cm~(-2) under optimal oxygen plasma etching conditions (10 min at a chamber pressure of 20 Pa). Confocal Raman mapping and scanning electron microscopy illustrate that the boron distribution in the diamond surface region is consistent with the distribution of whisker sites. The boron dopant atoms in the diamond appear to lead to the initial fine column formation. This simple method could provide a facile, cost-effective means for the preparation of conductive nanostructured diamond materials for electrochemical applications as well as electron emission devices.
机译:导电金刚石晶须是通过在高硼掺杂的金刚石基底上进行无掩模氧等离子体蚀刻而制成的。研究了刻蚀条件和金刚石中硼浓度对晶须形貌和整个衬底覆盖率的影响。高硼掺杂水平(大于8.4 X 10 cm)对于形成直径大约为1的纳米级密集堆积的晶须至关重要。 20 nm,长度约为200 nm,密度约为在最佳氧等离子体蚀刻条件下(在20 Pa的腔室压力下10分钟)为3.8 x 10〜(10)cm〜(-2)。共焦拉曼作图和扫描电子显微镜表明,金刚石表面区域的硼分布与晶须部位的分布一致。金刚石中的硼掺杂原子似乎导致了最初的细柱形成。这种简单的方法可以为制备用于电化学应用以及电子发射装置的导电纳米结构金刚石材料提供一种简便,经济高效的方法。

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