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The Development of the Adhesion Force Measurement Apparatus for Individual Particle Based on Electric Field Method

机译:基于电场法的各个粒子粘附力测量装置的开发

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We have developed the apparatus to measure the adhesion force of individual small particle by utilizing electric field between the small electrodes. When the electrostatic force acting on an electroconductive particle is stronger than the adhesion force of the particle on the bottom electrode, the particle begins to jump toward the top electrode. The adhesion state before and after the jumping of a particle is observed with the CCD camera set horizontally to the electrodes. We have determined the measurement conditions that should be satisfied in order to measure the adhesion force distributions with sufficient accuracy.
机译:我们开发了通过利用小电极之间的电场来测量单个小颗粒的粘附力。 当作用在导电颗粒上的静电力比底部电极上的颗粒的粘附力强,颗粒开始朝向顶部电极跳跃。 用CCD摄像机水平设置在电极之前和之后的粘合状态和之后的粘合状态。 我们已经确定了应满足的测量条件,以便以足够的精度测量粘合力分布。

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