首页> 外文期刊>Journal of Microscopy >Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters
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Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters

机译:微磁束的聚焦离子束制备探讨电镀纳米型铜与探针型压头的原因分析

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A site-specific xenon plasma focused ion beam preparation technique for microcantilever samples (1-20 mu m width and 1:10 aspect ratio) is presented. The novelty of the methodology is the use of a chunk lift-out onto a clean silicon wafer to facilitate easy access of a low-cost probe type indenter which provides bending force measurement. The lift-out method allows sufficient room for the indenter and a line of sight for the electron beam to enable displacement measurement. An electroplated nanotwinned copper (NTC) was cut to a 3 x 3 x 25 mu m microbeam andin situmechanically tested using the developed technique. It demonstrated measured values of Youngs modulus of 78.7 +/- 11 GPa and flow stress of 0.80 +/- 0.05 GPa, which is within the ranges reported in the literature. Lay Description In this paper a site specific method is present for making particularly small mechanical tests samples, of the order of 100(th)the size of a human hair. These small samples can then be used to determine the mechanical properties of the bulk material. Copper with a nano twinned grain structure is used as a test medium. Ion milling was used to cut the sample to shape and a micro probe was used for mechanical testing. Ion milling can cut away very small volumes of material as it accelerates ions at the surface of the sample, atomically machining the sample. Micro probes are a cost-effective small-scale load measurement devices, however, they require a large area for accessing the sample. The indenter requirements are a problem when making you samples with ion milling as ion millers are best at making small cuts. Our aim was to design a cutting strategy which reduces the amount of cutting required while allowing samples to be fabricated anywhere on the sample. We used a chunk lift out technique to remove a piece of material which is then welded to a wafer of silicon this gives sufficient space around the sample for ion milling and testing. The additional space allowed easy access for the probe. A 3 x 3 x 10 mu m micro cantilever beam was cut out from copper, this beam was then bent. The force from bending and distance bent was measured and converted into Youngs modulus which is a measure of flexibility. The modulus value measured was comparable to the values reported in other papers.
机译:提出了一种特定于特定的氙气等离子体聚焦离子束准备技术(1-20μm宽和1:10纵横比)。该方法的新颖性是使用块抬起在清洁的硅晶片上,以便于轻松访问提供弯曲力测量的低成本探针型压痕。剥离方法允许压紧的足够的空间和用于电子束的视线以实现位移测量。将电镀纳米型铜(NTC)切割成3×3×25μmmicrobeam,也可以使用开发的技术出发地测试。它证明了78.7 +/- 11 GPA的幼虫模量的测量值和0.80 +/- 0.05GPa的流量应力,这在文献中报道的范围内。在本文中描述了一个站点特定方法,用于制作特别小的机械测试样品,其中100(Th)的人头发的大小。然后可以使用这些小样品来确定散装材料的机械性能。使用纳米孪晶晶粒结构的铜用作试验介质。离子铣削用于切割样品以形状,并且使用微探针用于机械测试。离子铣削可以在样品表面加速离子,原子加工样品时切除非常小的材料。微探针是一种经济有效的小型负载测量装置,但是,它们需要大面积来访问样品。当ION MILLERS最佳制作小切割时,在使带离子铣削的样品中的样品时,压痕要求是一个问题。我们的目的是设计一种切割策略,减少了所需的切割量,同时允许样品在样品上的任何地方制造。我们使用了块升降技术来拆下一块材料,然后将其焊接到硅的晶片上,这在样品周围提供足够的空间以进行离子铣削和测试。额外的空间允许轻松访问探头。从铜中切出3×3×10μmmicro悬臂梁,然后弯曲该光束。测量弯曲和距离弯曲的力并转化为幼小模量,这是一种柔韧性的量度。测量的模量值与其他纸中报道的值相当。

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