首页> 外文期刊>Journal of Materials Chemistry, C. materials for optical and electronic devices >In situ one-step synthesis of p-type copper oxide for low-temperature, solution-processed thin-film transistors
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In situ one-step synthesis of p-type copper oxide for low-temperature, solution-processed thin-film transistors

机译:原位一步合成低温,溶液加工的薄膜晶体管p型氧化铜

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摘要

Solution-processed n-type oxide semiconductors have received great interest in thin-film transistor (TFT) applications. However, solution-processed p-type oxide semiconductors are not as successful as their n-type counterparts because of the lack of material choice and their complicated fabrication procedures. In this study, a simple one-step synthetic method was employed to fabricate a p-type Cu2O thin film-via in-situ reaction of a CuI film in aqueous NaOH solution at room temperature. The structure, morphology, and component variations as a function of annealing conditions (<= 350 degrees C) were investigated. The analysis indicates that the phase evolution of Cu2O - Cu2O + CuO -> CuO occurred at higher temperatures and the pure CuO phase was achieved at 250 degrees C. The crystallinity, average grain size, and surface morphology of the Cu(x)Othin films were found to increase in slope as the annealing temperature increased. To explore the possible applications of the obtained CuxO films as semiconducting channel components, bottom-gated TFTs on SiO2 gate dielectrics were constructed and examined. The hole mobility of the optimized device was calculated to be 0.32 cm(2) V-1 s(-1), along with an on/off current ratio of 5 x 10(4), and a subthreshold swing of 1.1 V dec(-1). The further integration of the CuxO film on an Al2O3 high-k dielectric achieves an improved device performance at 2.5 V. This work successfully demonstrates a simple method to fabricate p-type Cu-based thin films and TFTs via a solution route, which represents a great step towards the development of low-cost and alloxide complementary metal oxide semiconductor electronics.
机译:溶液加工的N型氧化物半导体已经对薄膜晶体管(TFT)应用感兴趣。然而,由于缺乏物质选择及其复杂的制造程序,溶液加工的P型氧化物半导体并不像它们的n型对应物那么成功。在该研究中,使用简单的一步合成方法在室温下在NaOH水溶液中制造铜膜中的原位反应。研究了作为退火条件(<= 350℃)的函数的结构,形态和组分变化。该分析表明,在较高温度下发生Cu 2 -Cu 2 O + CuO - > CuO的相位演化,纯CuO相在250℃下实现。结晶度,平均晶粒尺寸和Cu(x)othin薄膜的表面形态由于退火温度升高,发现斜坡增加。为了探讨所获得的Cuxo膜作为半导体通道部件的可能应用,构建并检查了SiO2栅极电介质上的底部门控TFT。优化器件的空穴迁移率是0.32cm(2)V-1s(-1),以及开/关电流比为5×10(4),以及1.1V DEC的亚阈值摆动( -1)。 Cuxo膜对Al2O3高k电介质的进一步整合实现了2.5 V的改进的装置性能。该工作成功地证明了一种简单的方法,通过溶液路线制造P型Cu基薄膜和TFT,这代表a迈向开发低成本和偶氮互补金属氧化物半导体电子产品的巨大步骤。

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