首页> 外文期刊>Journal of Materials Chemistry, C. materials for optical and electronic devices >Pyrazine as a noncovalent conformational lock in semiconducting polymers for enhanced charge transport and stability in thin film transistors
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Pyrazine as a noncovalent conformational lock in semiconducting polymers for enhanced charge transport and stability in thin film transistors

机译:吡嗪作为非共价构象锁定在半导体聚合物中,用于增强薄膜晶体管的电荷传输和稳定性

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摘要

Backbone engineering was performed on highly rigid semiconducting polymers to include diketopyrropyrrole (DPP) units combined with pyrazine-containing moieties. These new moieties were shown to improve backbone planarity through a conformational locking effect between nitrogen and sulfur atoms. The new polymers, characterized by various techniques, were shown to possess a highly crystalline and smooth solid-state morphology, optimal for charge transport. To verify the potential of the new semiconductor for organic electronics, a series of organic field-effect transistors was fabricated. Interestingly, the new polymer was shown to possess a charge mobility of 0.27 cm(2) V-1 s(-1) and on/off current ratio of 10(7), which is an improvement when compared to a thiophene analogue. More importantly, the polymer led to devices with high stability, with a retention of device characteristics when exposed to the same bias stress comparable to a benchmark reference polymer. The utilization of pyrazine-containing moieties as a conformational lock is a promising strategy to achieve a high performance conjugated polymer in a simple manner. Moreover, their utilization in bottom-gate bottom-contact devices highlights the potential of this new semiconductor for fully printed high-performance electronics.
机译:在高刚性半导体聚合物上进行骨干工程,包括二酮吡咯(DPP)单元与含吡嗪的部分组合。显示这些新部分通过氮气和硫原子之间的构象锁定效果来改善骨干平面度。以各种技术为特征的新聚合物具有高度结晶和光滑的固态形态,充电运输最佳。为了验证有机电子器件新半导体的电位,制造了一系列有机场效应晶体管。有趣的是,显示新的聚合物具有0.27cm(2)V-1s(-1)的电荷迁移率,并且与噻吩类似物相比,导通/关闭电流比为10(7),这是一种改善。更重要的是,聚合物导致具有高稳定性的装置,当暴露于与基准参考聚合物相当的相同偏置应力时,保持装置特性。含吡嗪的部分作为构象锁​​的利用是一种希望以简单的方式实现高性能共轭聚合物的有希望的策略。此外,它们在底门底部接触装置中的利用突出了该新半导体的潜力,用于全印刷的高性能电子设备。

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