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机译:用于大功率LED封装的银纳米粒子烧结粘接浆料的热性能
Guilin Univ Elect Technol Electromech Engn Coll 1 Jinji Rd Guilin 541004 Guangxi Peoples R China;
Guilin Univ Elect Technol Electromech Engn Coll 1 Jinji Rd Guilin 541004 Guangxi Peoples R China;
Guilin Univ Elect Technol Electromech Engn Coll 1 Jinji Rd Guilin 541004 Guangxi Peoples R China;
Guilin Univ Elect Technol Electromech Engn Coll 1 Jinji Rd Guilin 541004 Guangxi Peoples R China;
Guilin Univ Elect Technol Electromech Engn Coll 1 Jinji Rd Guilin 541004 Guangxi Peoples R China;
Guilin Univ Elect Technol Electromech Engn Coll 1 Jinji Rd Guilin 541004 Guangxi Peoples R China;
机译:用于大功率LED封装的银纳米粒子烧结粘接浆料的热性能
机译:电子封装用纳米银浆的低温烧结结合
机译:纳米银浆无压烧结以粘结大面积电子封装用大功率(每千日元零件100 mm(2))功率芯片的参数研究
机译:使用纳米银浆粘结高功率器件的在线烧结方法
机译:电子产品包装中的连接方法:烧结银和共晶粘合。
机译:低温预算光子烧结含亚微粒/纳米CuO / Cu2O颗粒的杂交糊
机译:用于大功率LED包装的银纳米粒子烧结粘接浆料的热性能