Application of a thermoacoustic method for the determination of air-tightness of the packagings of electronic devices

摘要

The thermoacoustic method of determination of the air-tightness of the packagings based on the measurement of the acoustic signals in the thermoacoustic chamber generated by the periodical heat dissipation in the transistor chips is described in this paper. This method makes possible estimation of the radius of the hole in the packaging and as a result its air-tightness. In this paper the theoretical model of the generation of the thermoacoustic signal and its fitting to experimental results are presented and discussed. Because of the simplicity and nondestructive character of the proposed method it can be applied in the quality control departments in the electronic industry.