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首页> 外文期刊>Journal of instrumentation: an IOP and SISSA journal >First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors
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First tests of a novel radiation hard CMOS sensor process for Depleted Monolithic Active Pixel Sensors

机译:用于耗尽整体活性像素传感器的新型辐射硬CMOS传感器过程的首次试验

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摘要

The upgrade of the ATLAS [1] tracking detector for the High-Luminosity Large Hadron Collider (LHC) at CERN requires novel radiation hard silicon sensor technologies. Significant effort has been put into the development of monolithic CMOS sensors but it has been a challenge to combine a lowcapacitance of the sensing node with full depletion of the sensitive layer. Lowcapacitance brings low analog power. Depletion of the sensitive layer causes the signal charge to be collected by drift sufficiently fast to separate hits from consecutive bunch crossings (25 ns at the LHC) and to avoid losing the charge by trapping. This paper focuses on the characterization of charge collection properties and detection efficiency of prototype sensors originally designed in the framework of the ALICE Inner Tracking System (ITS) upgrade [2]. The prototypes are fabricated both in the standard TowerJazz~3 180nm CMOS imager process [3] and in an innovative modification of this process developed in collaboration with the foundry, aimed to fully deplete the sensitive epitaxial layer and enhance the tolerance to non-ionizing energy loss. Sensors fabricated in standard and modified process variants were characterized using radioactive sources, focused X-ray beam and test beams before and after irradiation. Contrary to sensors manufactured in the standard process, sensors from the modified process remain fully functional even after a dose of 10~(15)_n_(eq)/cm~2, which is the the expected NIEL radiation fluence for the outer pixel layers in the future ATLAS Inner Tracker (ITk) [4].
机译:在CERN的高亮度大强子撞机器(LHC)的高亮度大强子撞机(LHC)的升级需要新颖的辐射硬硅传感器技术。重大努力已经投入了单片CMOS传感器的发展,但是将传感节点的低层耗竭充分消耗来挑战敏感层。低电容器带来低模拟功率。敏感层的耗尽使得通过漂移充分快速地收集信号电荷,以将来自连续束交叉(在LHC的25ns)分离并避免通过捕获来失去电荷。本文重点介绍了最初设计在Alice内部跟踪系统(ITS)升级的框架中最初设计的原型传感器的电荷收集性能和检测效率的特征。原型是在标准塔jazz〜3 180nm cmos成像过程中[3]的制造,并且在与铸造厂合作开发的该过程的创新修改中,旨在完全消耗敏感的外延层并增强对非电离能量的耐受性损失。在标准和改性工艺变体中制造的传感器使用放射源,在照射前后聚焦X射线束和测试梁。与标准过程中制造的传感器相反,即使在10〜(15)_N_(EQ)/ cm〜2的剂量之后,改性过程的传感器也仍然完全起作用,这是外像素层的预期镍钛辐射量未来的Atlas内部跟踪器(ITK)[4]。

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