In Situ Particle Removal Studies using an Optical Particle Counter

摘要

The removal of particles is considered to be a three-step process (see Figure 1). Physical andchemical parameters, such as temperature, viscosity, pH, and presence of surfactants can impacteach step differently. The first step (ka) is the detachment of the particle from the surface, whichbrings the particle in the boundary layer. The second step (kb) is the diffusion of the particle through the boundary layer into the bulk of the process liquids. If this does not occur before the wafer is dried, the particle will redeposit on the wafer surface. Finally, the particle has to be carried away from the wafer environment (kc) by filtration or draining of the contaminated process liquid.