Interconnect Fabrication on Polymer Substrate using Submicron/Nano Silver Particles with the Assistance of Low-Density Irradiations

摘要

Low-energy Xenon flash pulses permit sintering of spray-pyrolyzed submicron Ag particles (SMPs) into conductive tracks with acceptable electrical resistivity (16.7 mu omega cm) on polyimide film in several seconds without extra heating. Mixed with Ag nanoparticles (20% in weight ratio), the resistivity of the obtained sintered mixed pastes can be reduced to 12.6 mu omega cm, which is nearly the same as those formed using nanoparticle pastes (11.2 mu omega cm). Using irradiation on the polymer substrate side, more uniform sintered deposits with better electrical conductance (rho < 10 mu omega cm) and greater bending fatigue resistance could be achieved. This sheds light on a new method for preparing low-cost, bendable Ag interconnections.