首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >The preparation and mechanical properties of carbon/carbon (C/C) composite and carbon fiber reinforced silicon carbide (C-f/SiC) composite joint by partial transient liquid phase (PTLP) diffusion bonding process
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The preparation and mechanical properties of carbon/carbon (C/C) composite and carbon fiber reinforced silicon carbide (C-f/SiC) composite joint by partial transient liquid phase (PTLP) diffusion bonding process

机译:碳/碳(C / C)复合材料和碳纤维增强碳化硅(C-F / SiC)复合接头的制备和机械性能通过部分瞬态液相(PTLP)扩散粘合过程

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摘要

Using Ti/Ni/Ti multiple foils as interlayer, carbon/carbon (C/C) composite was bonded to carbon fiber reinforced silicon carbide (C-f/SiC) composite by partial transient liquid phase (PTLP) diffusion bonding process. The multiple gradient structures, i.e. C/C composite vertical bar Ti-C reaction layer vertical bar Ni-Ti intermetallic compound vertical bar residual Ni foil vertical bar Ni-Ti intermetallic compound vertical bar Ti-C reaction layer vertical bar C-f /SiC composite, were formed during joining process. All the interfaces are bonded well, except for some micro-pores appeared in the interface between the residual Ni layer and Ni-Ti layer. The shear strength of the joint was 44.7 +/- 12.8 MPa at room temperature. The X-ray result indicates that only diffraction peaks of C, TiCx, and Ni-Ti Intermetallic compound were observed, while no diffraction peaks of Si were found on the fracture surface. Thus, it could be deduced that fracture occurred in the interfacial area adjacent to C/C composite side.
机译:使用Ti / Ni / Ti多箔作为中间层,碳/碳(C / C)复合物通过部分瞬态液相(PTLP)扩散键合工艺键合到碳纤维增强碳化硅(C-F / SiC)复合材料中。多梯度结构,即C / C复合垂直条Ti-C反应层垂直棒Ni-Ti金属间化合物垂直棒残留Ni箔垂直杆Ni-Ti金属间化合物垂直条Ti-C反应层垂直杆CF / SiC复合材料,在加入过程中形成。除了在残留的Ni层和Ni-Ti层之间的界面中出现的一些微孔外,所有接口均匀。接头的剪切强度在室温下为44.7 +/- 12.8MPa。 X射线结果表明观察到C,TiCX和Ni-Ti金属间化合物的衍射峰,而在断裂表面上没有发现Si的衍射峰。因此,可以推导出在与C / C复合侧相邻的界面区域中发生断裂。

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