Microstructure evolution and wettability of Ag-Cu-Zn alloy on TiC-Ni cermet

摘要

Wetting of Ag-Cu-Zn alloy on TiC-Ni cermet was performed using a sessile drop method in vacuum and the interfacial microstructure was studied. A continuous (Cu, Ni) solid-solution layer was formed at the Ag-Cu-Zn/TiC-Ni cermet interface held at 810 degrees C for 10 min. According to the TEM results, an orientation relationship between the (Cu, Ni) solid-solution layer and the TiC particle at the interface was determined: TiC[4 (2) over bar 0]//(Cu, Ni) [0 (2) over bar 2], TiC(00 (2) over bar)//(Cu, Ni)(111). As the temperature increased to 960 degrees C, the (Cu, Ni) solid-solution layer dissolved into the liquid alloy and changed from continuous to discontinuous. The continuing growth of the (Cu, Ni) solid-solution layer at the interface at 810 degrees C was controlled by the Ni diffusion process from the TiC-Ni cermet to the liquid alloy. The average contact angles of the Ag-Cu-Zn alloy and Ag-Cu alloy on the TiC-Ni cermet were 19 degrees and 121.5 degrees at 810 degrees C, respectively. And the temperature increase had little effect on the final contact angle.