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首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Vacuum hot pressed AZ31/UCF/AZ31 composite sheets: Microstructure and mechanical properties
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Vacuum hot pressed AZ31/UCF/AZ31 composite sheets: Microstructure and mechanical properties

机译:真空热压AZ31 / UCF / AZ31复合板材:微观结构和机械性能

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Abstract AZ31 Mg alloy/unidirectional carbon fiber (UCF)/AZ31 composite sheets were fabricated with AZ91 Mg alloy powder as an adhesive using vacuum hot pressing (VHP) at various temperatures. Both the wettability and bonding strength of the UCF/AZ91 interfaces increased with increasing VHP temperature, resulting in an improvement of the mechanical properties of the composite sheets. The fracture mechanism of the composite sheets at low VHP temperature (500?°C) was the pullout of UCFs and delamination. In contrast, at 560?°C, partial debonding between the UCFs and AZ91 was the dominant failure mechanism, and an S-type fracture path surrounding the UCFs was observed. The bonding strength of the UCF/AZ91 interface was weaker than that of the AZ91/AZ31 interface for this composite. The sheet prepared at 585?°C exhibited the largest ultimate tensile strength of 252?MPa and an elongation of 13.2%. This behavior was attributed to the enhancement of the interfacial bonding strength due to the formation of Al4C3 and MgAl2C2 phases at the UCF/AZ91 interface. The hardness and modulus reached maximum values of 9.9 and 61?GPa, respectively, near the UCF/AZ91 interface. Highlights ? AZ31/UCF/AZ31 composite sheets was fabricated by vacuum hot pressing (VHP) method at different temperatures. ? The wettability and bonding strength of UCFs/AZ91 interfaces increased as the VHP temperature increased, which had beneficial effect on the mechanical properties of the sheets. ? The fracture mechanism at 500?°C was the pullout of UCFs and delamination. At 560?°C, partial debonding between UCFs and AZ91 was the dominant failure mechanism. ]]>
机译:<![CDATA [ 抽象 AZ31 Mg合金/单向碳纤维(UCF)/ AZ31复合板用AZ91 Mg合金粉末制成作为一个在各种温度下使用真空热压(VHP)的粘合剂。随着VHP温度的增加,UCF / AZ91界面的润湿性和粘合强度均增加,导致复合片材的力学性能改善。在低VHP温度(500Ω·℃)下复合片材的断裂机制是UCF和分层的拉出。相比之下,在560℃下,UCF和AZ91之间的部分剥离是主要的失效机制,并且观察到UCFS周围的S型骨折路径。 UCF / AZ91界面的粘接强度弱于该复合材料的AZ91 / AZ31界面的粘合强度。在585℃下制备的片材表现出最大的最大抗拉强度为252μm≤252μm≤252μm的伸长率和13.2%的伸长率。这种行为归因于由于AL 4 C 3 和MGAL 2 C 2 阶段在UCF / AZ91接口处。硬度和模量分别达到UCF / AZ91接口附近的最大值为9.9和61? :Ce =“http://www.elsevier.com/xml/common/dtd”xmlns =“http://www.elsevier.com/xml/ja/dtd”class =“author-fighlights”xml:lang = “en”id =“abs0015”查看=“全部”> 突出显示 AZ31 / UCF / AZ31通过在不同温度下的真空热压(VHP)方法制造了AZ31 / UCF / AZ31复合板。 UCFS的润湿性和绑定强度/ AZ91接口随着VHP温度的增加而增加,这对片材的机械性能具有有益的影响。 500?°的断裂机制C是UCFS和分层的拉出。在560℃下,UCF和AZ91之间的部分剥离是主导失败机制。 ]]>

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