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首页> 外文期刊>Wear: an International Journal on the Science and Technology of Friction, Lubrication and Wear >Investigation on stress distribution and wear behavior of brazed polycrystalline cubic boron nitride superabrasive grains: Numerical simulation and experimental study
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Investigation on stress distribution and wear behavior of brazed polycrystalline cubic boron nitride superabrasive grains: Numerical simulation and experimental study

机译:钎焊多晶立方硼氮化物氮化物颗粒的应力分布及磨损行为调查:数值模拟与实验研究

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摘要

The polycrystalline cubic boron nitride (PCBN) superabrasive grains, which are comprised of micro crystalline CBN particles and AIN ceramic binder, have a distinguished advantage in self-sharpness during grinding by means of controllable fracture wear. The present work intends to clarify the mechanism of grain fracture based on the analysis of brazing-induced residual stress and the resultant stress in grinding; as such, the grain fracture wear could be predicted and controlled effectively. A finite element model based on Voronoi tessellation method has been first established for PCBN grains. The effects of embedding depth, volume fraction, and grinding loads on the stress distribution within PCBN grains are discussed. It is found that the distribution patterns of microcrystalline CBN particles generally have less influence on grain fracture. Large tensile stress is produced at the interfaces of microcrystalline CBN particles, AIN ceramic binder and Ag-Cu-Ti filler. Particularly, the largest tensile stress is generated near the grain vertex in the case of the embedding depth of 50%, volume fraction of 80%, and uncut chip thickness of 0.6 mu m. The simulation results are verified experimentally through characterizing the wear topography evolution of brazed PCBN grains in grinding. (C) 2017 Elsevier B.V. All rights reserved.
机译:由微晶CBN颗粒和AIN陶瓷粘合剂组成的多晶立方氮化硼(PCBN)超级磨粒,通过可控的裂缝磨损在研磨期间在自锐度下具有显着的优势。本作者旨在基于钎焊诱导的残余应力分析和研磨中所得应力的分析来阐明谷物骨折的机理;因此,可以有效地预测和控制颗粒骨折磨损。首先为PCBN谷物建立了基于Voronoi Tessellation方法的有限元模型。讨论了嵌入深度,体积分数和研磨载荷对PCBN晶粒内应力分布的影响。发现微晶CBN颗粒的分布模式通常对晶粒骨折的影响较小。在微晶CBN颗粒,AIN陶瓷粘合剂和Ag-Cu-Ti填料的界面下产生大的拉伸应力。特别是,在嵌入深度为50%,体积分数的80%,未切割芯片厚度为0.6μm的情况下,在谷物顶点附近产生最大拉伸应力。通过表征钎焊PCBN颗粒在研磨中的磨损地形演变来实验进行了仿真结果。 (c)2017 Elsevier B.v.保留所有权利。

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