机译:杂化有机/无机壳微胶囊/热固性树脂纳米复合材料的增强的热和介电性能
Soochow Univ Dept Mat Sci &
Engn Jiangsu Key Lab Adv Funct Polymer Design &
Applic Suzhou 215123 Peoples R China;
Soochow Univ Dept Mat Sci &
Engn Jiangsu Key Lab Adv Funct Polymer Design &
Applic Suzhou 215123 Peoples R China;
Soochow Univ Dept Mat Sci &
Engn Jiangsu Key Lab Adv Funct Polymer Design &
Applic Suzhou 215123 Peoples R China;
Soochow Univ Dept Mat Sci &
Engn Jiangsu Key Lab Adv Funct Polymer Design &
Applic Suzhou 215123 Peoples R China;
Soochow Univ Dept Mat Sci &
Engn Jiangsu Key Lab Adv Funct Polymer Design &
Applic Suzhou 215123 Peoples R China;
thermosetting resin; microencapsulation; thermal stability; flame retardancy; dielectric property;
机译:杂化有机/无机壳微胶囊/热固性树脂纳米复合材料的增强的热和介电性能
机译:具有有机/无机杂化壳的新型环氧树脂填充微胶囊的合成与表征,用于高性能树脂的自修复
机译:使用新型有机-无机杂化介孔二氧化硅POSS-MPS制备的二氧化硅/环氧树脂纳米复合材料的介电和机械性能得到改善
机译:无机 - 有机纳米复合材料的热和介电性能,包括环氧树脂和多面体低聚倍增蛋白酶
机译:无机和杂化(有机-无机)纤维以及具有微米和纳米尺寸的核-壳结构的电流体动力学制造。
机译:含有烯丙基苯并恶嗪和POSS的有机-无机杂化对环氧树脂的热性能和阻燃性的影响
机译:涉及OMMT粘土和氰酸酯-硅氧烷改性环氧树脂的无机/有机杂化纳米复合材料:热,介电和形态学性质