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首页> 外文期刊>Superconductor Science & Technology >High quality superconducting titanium nitride thin film growth using infrared pulsed laser deposition
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High quality superconducting titanium nitride thin film growth using infrared pulsed laser deposition

机译:高质量超导钛氮化钛薄膜生长使用红外脉冲激光沉积

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Superconducting titanium nitride (TiN) thin films were deposited on magnesium oxide, sapphire and silicon nitride substrates at 700 degrees C, using a pulsed laser deposition (PLD) technique, where infrared (1064 nm) pulses from a solid-state laser were used for the ablation from a titanium target in a nitrogen atmosphere. Structural studies performed with x-ray diffraction showed the best epitaxial crystallinity for films deposited on MgO. In the best films, superconducting transition temperatures, T-C, as high as 4.8 K were observed, higher than in most previous superconducting TiN thin films deposited with reactive sputtering. A room temperature resistivity down to similar to 17 mu Omega cm and residual resistivity ratio up to 3 were observed in the best films, approaching reported single crystal film values, demonstrating that PLD is a good alternative to reactive sputtering for superconducting TiN film deposition. For less than ideal samples, the suppression of the film properties were correlated mostly with the unintended incorporation of oxygen (5-10 at%) in the film, and for high oxygen content films, vacuum annealing was also shown to increase the T-C. On the other hand, superconducting properties were surprisingly insensitive to the nitrogen content, with high quality films achieved even in the highly nitrogen rich, Ti:N = 40/60 limit. Measures to limit oxygen exposure during deposition must be taken to guarantee the best superconducting film properties, a fact that needs to be taken into account with other deposition methods, as well.
机译:使用脉冲激光沉积(PLD)技术,在700℃下沉积在氧化镁,蓝宝石和氮化硅基材上的超导氮化钛(锡)薄膜,其中来自固态激光器的红外(1064nm)脉冲用于从氮气氛中的钛靶的消融。用X射线衍射进行的结构研究显示了沉积在MgO上的薄膜的最佳外延结晶度。在最佳薄膜中,观察到超导过渡温度,高达4.8k的高达4.8k,高于最先前的超导锡薄膜,沉积在反应溅射中。在最佳薄膜中观察到下降至类似于17μmomgacm和剩余电阻率比的室温电阻率,并且在最佳的薄膜中观察到最多3,所以报道的单晶膜值,表明PLD是用于超导锡膜沉积的反应溅射的良好替代方案。对于少于理想的样品,抑制膜性质主要是在薄膜中的意外掺入(5-10at%),并且对于高氧含量薄膜,还显示真空退火以增加T-C。另一方面,超导性能令人惊讶地对氮含量不敏感,即使在高氮气中达到高质量的薄膜,也可以达到富氮,Ti:n = 40/60限制。必须采取限制沉积期间氧气暴露的措施以确保最佳超导膜性能,这是其他沉积方法需要考虑的事实。

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