Silicon-photonic-based PIC modulators scale up for dense datacenter interconnects

摘要

Cost-efficient small-form-factor coherent modulators that leverage scalable silicon photonic architectures reach higher levels of integration than InP or LiNbO_3 for high-baud-rate datacenter interconnect demands. The proliferation of mega-sized data-centers along with distributed optical communications architectures is creating high-volume demand for datacenter interconnect (DCI) coherent transmission systems that offer high capacity per channel and per fiber.