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首页> 外文期刊>Lasers in engineering >Rapid Prototyping of a Seven Layer Microfluidic Chip with Different Polymer Sheets Using Hot Bonding and a CO2 Laser Beam
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Rapid Prototyping of a Seven Layer Microfluidic Chip with Different Polymer Sheets Using Hot Bonding and a CO2 Laser Beam

机译:具有热粘结和CO2激光束的不同聚合物片的七层微流体芯片的快速原型。

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摘要

A process of fabricating a seven layer microfluidic chip using CO2 laser processing and hot bonding technology is presented. The applied polymer substrates were poly(methyl-methacrylate) (PMMA), polycarbonate (PC), polystyrene (PS) and polyethylene terephthalate (PET). The results show the optimal combination of polymer substrates for the seven layer microfluidic chip at the hot bonding parameters of bonding temperature of 100 degrees C and bonding pressure of 1 MPa for maintaining times of nine minutes. Due to the different properties of the polymer substrates, the profile of the microchannel in the different polymer sheets for the same CO2 laser processing parameters. The maximum tensile strength of the microfluidic was measured as 1.0 MPa. The combined polymers with the minimum binding force were PC and PMMA. At the end, a mixing experiment was performed in the seven layer microfluidic chip with different fluid Re numbers.
机译:提出了使用CO2激光加工和热粘合技术制造七层微流体芯片的过程。 所施加的聚合物底物是聚(甲基丙烯酸甲酯)(PMMA),聚碳酸酯(PC),聚苯乙烯(PS)和聚对苯二甲酸乙二醇酯(PET)。 结果显示了七层微流体芯片的聚合物衬底的最佳组合在粘接温度为100摄氏度的热粘接参数和1MPa的键合压力下保持九分钟的时间。 由于聚合物基板的特性不同,微通道在不同的聚合物片中用于相同的CO2激光加工参数的曲线。 测量微流体的最大拉伸强度为1.0MPa。 具有最小结合力的合并聚合物是PC和PMMA。 最后,在七层微流体芯片中进行混合实验,具有不同的流体RE。

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